Under funding from NASA’s Earth Science Technology Office (ESTO), Leonardo DRS developed and flight-tested a six-band thermal sensor to demonstrate its potential utility as a low-cost space-bourne ...
As the reality of true 3D IC design nears, engineering teams are keen to manage the heat between the stacked die in order to avoid catastrophic failures. Thermal modeling tops the roster of techniques ...
New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal ...
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