October 26, 2012. Aegis Software announced that Sechan Electronics Inc., a contract manufacturing services company, chose Aegis’ Quality System as a replacement for Sechan's paper-based defect mapping ...
Researchers used AI-guided electron microscopy to map atomic-level point defects in 3D within ultrathin MXene layers, ...
As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...
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