Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates. To improve the ...
JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from ...
This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...
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