Conclusions: Clinical processes used to provide initial visits for OC services varied demonstrably across study sites, generating variation in cost with little impact on clinical quality or patient ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV process steps, which include lithography patterning followed by deep reactive ion ...

Advanced process technologies are generating significant challenges for modern IC designers as the physics of the 130- and 90-nanometer generation bring what were previously noise-level effects to the ...

The Variation Designer solution is a truly scalable and extensible solution for meeting design challenges created by process variations at nanometer feature sizes. It allows designers to expand their ...

Chipmakers are pushing into sub-threshold operation in an effort to prolong battery life and reduce energy costs, adding a whole new set of challenges for design teams. While process and environmental ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...