IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

Facility layout and design is an important component of a business’s overall operations, both in terms of maximizing the effectiveness of the production process and meeting the needs of employees. The ...

As we all know, the back-end design of layout implementation known as integrated circuit (IC) layout — is simplistically divided into ASIC-style flow and full-custom flow. This article will try to ...