SK hynix continues development of next-generation DRAM and AI memory solutions, targeting improved efficiency and performance ...
The South Korean chipmaker commenced commercial manufacturing of its high-capacity SOCAMM2 modules designed for artificial intelligence computing infrastructure.
TL;DR: Samsung's 1c DRAM yield for next-gen HBM4 memory has improved from 0% to around 40%, enabling planned mass production later this year. Design restructuring and process optimizations enhanced ...
Samsung has started producing 64GB DRAM modules for servers based on emerging DDR4 (double-data rate 4) memory using 3D “through silicon via” (TSV) package technology. The 64GB capacity is the largest ...
Samsung has officially announced it has started begun mass production for the industry’s thinnest LP (Low Power) memory modules. The 12-nanometer LPDDR5X DRAM modules should be available in 12GB and ...
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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module
NEO Semiconductor is once again announcing a new technology that hopes to revolutionize the state of DRAM memory. Today, the company unveiled two new 3D X-DRAM cell designs, 1T1C and 3T0C. The ...
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