Momentum for sharing memory resources between processor cores is growing inside of data centers, where the explosion in data is driving the need to be able to scale memory up and down in a way that ...

Renesas Electronics Corp. claims the industry’s first complete memory interface chipset solutions for the second-generation DDR5 MRDIMMs. The chipset solutions include a new multiplexed registered ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

AMD is a company that is certainly no stranger to building semi-custom processors. Indeed, the semi-custom unit of the company basically kept it afloat for a couple of years before the launch of Ryzen ...

Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Unveiled at ISSCC 2025, the new 3D flash memory innovation, ...

With CPU core counts and GPU silicon sizes simply skyrocketing, it's become harder and harder to feed all that processing power with data. Regular old DRAM packages just aren't cutting it anymore for ...

CXL memory expanders give new life to DDR4 memory.

With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect (in fact the 2024 OCP Summit has a whole day dedicated to the multi-die topic, on ...