Hosted on MSN

The chip technology that finally gives Intel an edge over TSMC

The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...
Semiconductor Engineering

Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers

Backside power delivery reduces routing congestion at the most advanced nodes and offers significant performance improvement options. But it also adds a bunch of new challenges involving via alignment ...
Semiconductor Engineering

Wafer Warpage Evolution During Key Backside Power Delivery Network Fabrication Steps (Korea Univ., Georgia Tech)

A new technical paper titled “Process-Induced Warpage Behavior in Backside Power Delivery Network Fabrication” was published by researchers at Korea University and Georgia Institute of Technology. “As ...
Seeking Alpha

Ansys Multiphysics Signoff Solutions Certified for Samsung's 2nm Power Backside Delivery Technology

Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for Samsung's SF2Z manufacturing technology Ansys solutions enable early adopters to reliably design leading-edge ...